Semiconductor Devices, Materials, and Processes
8
Credit(s)
Credit(s)
Undergraduate
Academic Level
Academic Level
Tuition-based
Cost
Cost
This microcredential prepares you with the skills, competencies and knowledge to work in the semiconductor industry.
You'll learn about the operation, characteristics and applications of various semiconductor devices such as diodes, transistors (bipolar junction transistors and field-effect transistors), optoelectronic devices (LEDs and lasers), and integrated circuits (ICs).
You'll understand the characteristics of different semiconductor materials like silicon, gallium arsenide and various compound semiconductors.
In addition, you'll learn how various semiconductor processes are integrated into a cohesive manufacturing flow, including process sequences, process optimization, yield improvement and process integration challenges.
Additional Information:
Course 1: INEN 405 - Micro and Nano Materials Processing Technology (4 credits)
This course provides a basic knowledge of manufacturing processes utilized in the fabrication of semiconductor devices in the 300mm wafer fab environment.
You'll study processing that includes oxide deposition, photolithography, ion implantation, doping, passivation, etching, electroplating, planarization that are used in state-of-the-art fabrication of transistors, integrated circuits and similar device structures will be reviewed.
Prerequisite: Permission of Instructor
Prerequisite permission may be considered for waiver with the following conditions:
- Associates degree or higher in physics, chemistry, materials science or engineering
- 3 or more years of experience in advanced manufacturing, materials processing or chemical synthesis
Course 2: INEN 406 - Fundamentals of Nanoelectonics (4 credits)
In this course, you'll be Introduced to nanoscale electronic devices. It includes basic, band theory-derived operation of semiconductor devices including p-n junctions (diodes) and transistors (bi-polar and classic field-effect devices).
You'll study classic, solid-state analysis of energy bands, electrostatic band-bending, diffusion current, drift current, carrier generation, and carrier recombination in both equilibrium and field-biased conditions. This analysis is combined with the introduction and review of quantum statistics for holes and electrons.
Specific applications are treated with respect to metal-semiconductor contacts and selected semi-metal (carbon) systems. You'll be introduced to device-level testing through the use of advanced wafer level probes in the CNSE 300mm full flow process facility.
Prerequisite: Permission of Instructor
Prerequisite permission may be considered for waiver with the following conditions:
- Associates degree or higher in physics, chemistry, materials science or engineering
- 3 or more years of experience in advanced manufacturing, materials processing, or chemical synthesis
These courses can be applied to:
This microcredential may only be taken for credit.