Jakub Nalaskowski

Interests:

• Fundamental and applied aspects of chemical mechanical planarization (CMP) and surface cleaning in semiconductor manufacturing. Surface chemistry and dispersed systems characterization. 
• Interaction force, adhesion and friction measurements at nanoscale using scanning probe microscopy. 
• Wet separation techniques in material recycling and mineral processing.
• CMP process development for advanced FEOL and BEOL applications.
   

Fundamental understanding, ability to characterize, and manipulate nanoscale phenomena, is necessary for further technological progress in many industries. My research focuses on development of advanced CMP processes for FEOL and BEOL applications in semiconductor industry. Particle-particle and particle-surface interactions, their characterization and modification are of special interest, including use of scanning probe microscopy for direct force measurements. Combination of surface science understanding and engineering practice leads to improvements in CMP process performance for advanced nodes and novel applications.